- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
Patent holdings for IPC class H01L 21/288
Total number of patents in this class: 1482
10-year publication summary
123
|
203
|
171
|
156
|
153
|
110
|
88
|
66
|
74
|
12
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
108 |
Tokyo Electron Limited | 11599 |
82 |
Lam Research Corporation | 4775 |
80 |
Applied Materials, Inc. | 16587 |
62 |
International Business Machines Corporation | 60644 |
38 |
Ebara Corporation | 1951 |
32 |
Novellus Systems, Inc. | 559 |
29 |
Mitsubishi Electric Corporation | 43934 |
28 |
Alchimer | 52 |
27 |
FUJIFILM Corporation | 27102 |
26 |
Atotech Deutschland GmbH | 586 |
26 |
Texas Instruments Incorporated | 19376 |
25 |
Infineon Technologies AG | 8189 |
21 |
BASF SE | 19740 |
19 |
Micron Technology, Inc. | 24960 |
19 |
Konica Minolta Holdings, Inc. | 1086 |
18 |
Semiconductor Components Industries, L.L.C. | 5345 |
18 |
Samsung Electronics Co., Ltd. | 131630 |
17 |
MacDermid Enthone Inc. | 237 |
17 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
15 |
Other owners | 775 |